МАТCHING COLUMN A COLUMN B NUMBER a. Plain carbon steel with 0.4 wt% carbon 1. Arrhenius Equation b. Highly hardenable low alloy steel 2. Hypereutectoid steel c. Processing of granular materials d. Critically resolved shear stress 3. Porous structure 4. Grain size e. Stress relief anneal 5. Oxidation 6. Required for dislocation motion 7. Recovery 8. TTT diagram f. Isothermal condition g. Metastable phase in plain carbon steels h. Annealed metal defect density i. Thick lamellar structure 9. AISI 4340 j. Thermally activated processes 10. Martensite k. Electrochemical potential 11. 10 /cm² 1. Degree of polymerization 12. Grain boundary strengthening m. Root of brittleness in ceramics 13. Coarse pearlite n. Slip plane in FCC 14. CCT diagram o. Hall-Petch relationship 15. # density of precipitates p. Cathodic reaction 16. Standard EMF series q. Eutectic reaction 17. 1012 /cm² r. 3D defect 18. Liquid A →Solid B + Solid C s. Eutectoid reaction t. Vitrified liquid 19. Close packed plane 20. Polymer chain length 21. Reduction 22. Glass | 23. Liquid A →Solid A + Liquid B 24. AISI 1040 25. Void 26. Solid A →Solid B + Solid C 27. Sintering 120

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
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Problem 1.1MA
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H1.
MATCHING
COLUMN A
COLUMN B
NUMBER
a. Plain carbon steel with 0.4 wt% carbon
1. Arrhenius Equation
b. Highly hardenable low alloy steel
2. Hypereutectoid steel
c. Processing of granular materials
3. Porous structure
d. Critically resolved shear stress
4. Grain size
e. Stress relief anneal
5. Oxidation
f. Isothermal condition
6. Required for dislocation motion
7. Recovery
8. TTT diagram
9. AISI 4340
g. Metastable phase in plain carbon steels
h. Annealed metal defect density
i. Thick lamellar structure
j. Thermally activated processes
10. Martensite
k. Electrochemical potential
11. 106 /cm²
1. Degree of polymerization
12. Grain boundary strengthening
m. Root of brittleness in ceramics
13. Coarse pearlite
n. Slip plane in FCC
14. CCT diagram
o. Hall-Petch relationship
15. # density of precipitates
p. Cathodic reaction
16. Standard EMF series
q. Eutectic reaction
r. 3D defect
s. Eutectoid reaction
17. 1012 /cm2
18. Liquid A →Solid B + Solid C
19. Close packed plane
t. Vitrified liquid
20. Polymer chain length
21. Reduction
22. Glass
23. Liquid A >Solid A + Liquid B
24. AISI 1040
25. Void
26. Solid A > Solid B + Solid C
| 27. Sintering
720
4/23
Transcribed Image Text:MATCHING COLUMN A COLUMN B NUMBER a. Plain carbon steel with 0.4 wt% carbon 1. Arrhenius Equation b. Highly hardenable low alloy steel 2. Hypereutectoid steel c. Processing of granular materials 3. Porous structure d. Critically resolved shear stress 4. Grain size e. Stress relief anneal 5. Oxidation f. Isothermal condition 6. Required for dislocation motion 7. Recovery 8. TTT diagram 9. AISI 4340 g. Metastable phase in plain carbon steels h. Annealed metal defect density i. Thick lamellar structure j. Thermally activated processes 10. Martensite k. Electrochemical potential 11. 106 /cm² 1. Degree of polymerization 12. Grain boundary strengthening m. Root of brittleness in ceramics 13. Coarse pearlite n. Slip plane in FCC 14. CCT diagram o. Hall-Petch relationship 15. # density of precipitates p. Cathodic reaction 16. Standard EMF series q. Eutectic reaction r. 3D defect s. Eutectoid reaction 17. 1012 /cm2 18. Liquid A →Solid B + Solid C 19. Close packed plane t. Vitrified liquid 20. Polymer chain length 21. Reduction 22. Glass 23. Liquid A >Solid A + Liquid B 24. AISI 1040 25. Void 26. Solid A > Solid B + Solid C | 27. Sintering 720 4/23
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