An electronic component, 65 mm×65 mm, in steady state operation reaches the base temperature of 100°C. To help dissipate heat 10 rectangular fins (2mm-thick, 10- mm long, k=70 W/mK) are to be soldered to the chip as shown in the figure below. The ambient temperature and convection heat transfer coefficients are given as 20°C and 50 W/m²K, respectively. Assuming radiation losses and the heat transfer from the back side of the circuit board are negligible, and the temperature of the surrounding surfaces to be the same as the air temperature of the room. (a) Calculate the heat transfer from the electronic component without the fins, (b) Calculate the heat transfer with the fins, (c) Do you recommend the use of this fin configuration? 2mm | 10mm 65mm 65mm T

An electronic component, 65 mm×65 mm, in steady state operation reaches the base temperature of 100°C. To help dissipate heat 10 rectangular fins (2mm-thick, 10- mm long, k=70 W/mK) are to be soldered to the chip as shown in the figure below. The ambient temperature and convection heat transfer coefficients are given as 20°C and 50 W/m²K, respectively. Assuming radiation losses and the heat transfer from the back side of the circuit board are negligible, and the temperature of the surrounding surfaces to be the same as the air temperature of the room. (a) Calculate the heat transfer from the electronic component without the fins, (b) Calculate the heat transfer with the fins, (c) Do you recommend the use of this fin configuration? 2mm | 10mm 65mm 65mm T

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)

8th Edition

ISBN:9781305387102

Author:Kreith, Frank; Manglik, Raj M.

Publisher:Kreith, Frank; Manglik, Raj M.

Chapter1: Basic Modes Of Heat Transfer

Section: Chapter Questions

Problem 1.45P: An electronic device that internally generates 600 mW of heat has a maximum permissible operating...

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